MPI TS2000-SE | 200 mm Automated Probe System For accurate and reliable DC/CV, RF and mmW measurements

The TS2000-SE from MPI is the first ever 200mm automated engineering probe system on the market integrating innovative features specifically designed to reduce the cost of test. These features are incorporated into the MPI ShielDEnvironment™ for ultra-low noise, very accurate and highly reliable DC/CV, RF and High Power measurements.

FEATURES / BENEFITS
Designed for a Wide Variety of On-Wafer Measurement Applications

• Device Modeling - DC-IV / DC-CV / Pulse-IV
• RF and mmW - RF Setup from 26 GHz to 110 GHz & beyond
• Failure Analysis - Probe card / Internode Probing
• Wafer Level Reliability - Hot / Cold / Long-term test • High Power Device - Up to 10 kV / 600 A

MPI ShielDEnvironment™ for Accurate Measurements

• Designed for Advanced EMI / RFI / Light-Tight Shielding
• Ready for temperature range -60 °C to 300 °C

Ergonomic Design and Options

• Front and advanced automated single wafer side loading capability with easy pre-alignment for automated routines
• Vertical Control Environment (VCE™) with observation of the probing area from the side for safe operation
• Integrated active vibration isolation
• Completely integrated prober control for faster, safer and convenient system and test operation
• The Safety Test Management (STM™) option to load/unload wafers at any chuck temperatures and auto dew point control

ShielDCap™ 

• Consequent shielding and easy re-configuration
• Allows up to 4-port RF or up to 8-ports DC/Kelvin or a combination of those configurations
• Probe card version available ShielDEnvironment™
• Excellent EMI- and light-tight shielded test environment for ultra-low noise, low capacitance measurements
• Front door for manual loading of IC or wafers

Probe Platen

• Stable and rigid design
• Rectangular adjustments for RF positioners
• Integrated air-cooling for maximum thermal stability
• Unique access for maintenance and service

Vertical Controlled Environment™ (VCE)

• Automated side view of the probe tips – the VCE™ allows contact position automation independent of the probe card tip-drop
• This enables working with probe cards, either DC or RF, very safe, especially inside the MPI ShielDEnvironment™

Modular Chucks

• Various non-thermal or thermal chucks
• Choice of Triaxial or Coaxial connection
• Wide range of temperature from -60°C up to 300 °C
• Field upgradable for reduced cost of ownership
  

RF Calibration

• 2 auxiliary chucks for calibration substrates
• Built-in ceramic for accurate calibration
• 1 µm flatness for consistent contact quality

Safety Test Management™ (STM) System

• Provides unique safety, reliable and convenient environment for testing at different temperatures
• Intelligent dew point control routine avoids acumination during cold testing
• Automatically monitoring the flow of CDA or Nitrogen
• If the flow is interrupt or insufficient the STM™ turns the chuck automaticall into a safe mode

Software Suite SENTIO®

• Simple and intuitive operation by revolutionary, multi-touch software control saves significant training time
• Scroll, Zoom, Move commands mimic modern smart mobile devices and allows to become an expert in just minutes
• Switching between the active application and the rest of the APPs is just matter of a simple finger sweep
• MPI RF calibration software program QAlibria® is fully integrated with SENTIO® – for ease of use by following a single operational 
  concept methodology
• GPIB, TCP/IP interface for remote control
  

Microscope and Optics Options

• Stable microscope bridge mount with 50 x 50 x 140 mm programmable movement
• Various optics options available such as MPI AMZ12 w. up to 12x optical zoom or MPI iMAG® - the digital microscope
  

Thermal Control

• Thermal chuck can be operated by using the fully integrated touch-screen display placed at convenient location in front of the operator for fast operation and immediate feedback
  

Automated single wafer loader 

• Very convenient wafer loading with easy pre-alignment for automated routines
• Loading or unloading of 100, 150 or 200 mm wafer is straight forward and intuitive Hot/cold wafer swaps at set temperatures
• Unique capability to load/unload wafers at any chuck temperatures 
• Saves major down time and increases the overall MPI Test Systems efficiency significantly

Integrated Hardware Control Panel

• Provide faster, safer and convenient system control and test operation
• The Keyboard and mouse are strategically located to control the software if necessary and will also control the Windows® based 
  instrumentation

Active Vibration Isolation

• Incorporates a high performance vibration isolation platform
• Optimized total footprint
• Optional instrument shelf reduces cable lengths and increases measurement dynamic and directivity